Package Information

Package Outline Drawings

Figure 1. Package Top View
Figure 2. Package Side View
Figure 3. Package Side View Detail A
Figure 4. Package Bottom View

Package Information

  • Package type: TFBGA

  • Package ball count: 625

  • Body size: 17x17 mm

  • Package ball pitch: 0.65 mm

  • Package dimensions:
    Table 1. Package Dimensions
    Dimension Minimum Nominal Maximum
    A - 1.670 1.761
    A1 0.220 0.270 0.320
    A2 1.329 1.400 1.476
    b 0.300 0.350 0.400
    Note:
    • All dimensions and tolerances comply with Y14.5M-2018.
    • Terminal positions designations follow JESD95 standards.
    • The corner as mentioned in the Package Top View should follow details according to StarFive option.
    • Pin 1 identifier can be a chamfer, an ink mark, a lasered mark, or a metallized mark.
    • Ball diameter is measured after reflow soldering.
    • Dimension "b" as mentioned in the Package Bottom View is measured at the maximum solder ball diameter parallel to primary Datum C.
    • A 0.35 mm raw solder ball shall be adopted during assembly process.

Package Thermal Characteristics

For reliability and operation concerns, the absolute maximum junction temperature shall be below 125 ℃.

The following table provides the thermal resistance characteristics for the package used on JH-7110.
Table 2. Thermal Resistance Characteristics
Power 𝜽𝑱𝑨 𝜽𝑱𝑩 𝜽𝑱𝑪
5 W 8.1 ℃/W 1.39 ℃/W 0.46 ℃/W